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Thermo Fisher Helios G4 PFIB UXe

Thermo Fisher Helios G4 PFIB UXe

Materials Science, Electronic and Optical Devices, Biological Sciences, Geological Sciences, Defect and Failure Analysis, Sample preparation for other techniques

  • High resolution SEM Imaging (features <10 nm)
  • Large feature cross sections (>100 um)
  • Polishing of delicate samples for imaging and EBSD
  • FIB tomography serial sectioning for 3D reconstruction
  • FIB tomography for 3D EDS reconstructions
  • TEM and APT specimen preparation of Ga sensitive materials

Allen Hunter

Room G021

Publications, presentations, and posters resulting from work on this instrument should state: “The authors acknowledge the financial support of the University of Michigan College of Engineering and technical support from the Michigan Center for Materials Characterization.“

  • Electron Beam Source: Schottky Field Emitter
  • Ion Beam Source: Inductively coupled Xe Gas Plasma
  • Accelerating Voltages
    • Electrons: 350V to 30 kV (20eV minimum landing energy using Beam Deceleration)
    • Ions: 2 kV to 30 kV
  • Beam Currents
    • Electrons: 0.8 pA – 100 nA (0.8 pA – 100 pA in UC Mode)
    • Ions: 1.5 pA – 2.5 uA (in 20 steps)
  • Detectors
    • Electron and Ion Beam Imaging – Everhart-Thornley Detector (ETD)
    • Electron and Ion Beam Imaging – Through-the-lens Detector (TLD)
    • Electron and Ion Beam Imaging – Ion Conversion and Electron Detector (ICE)
    • ETD, TLD, and ICE detectors can operate in Secondary and Backscatter electron modes, and custom modes for charge suppression for SEM imaging
    • ICE detector can operate in both Secondary Electron and Secondary Ion modes for FIB imaging
    • Internal mounted NavCam for sample navigation
    • Internal mounted CCD camera to view stage and samples
  • Energy Dispersive Spectroscopy (EDS) – ThermoFisher Pathfinder EDS UltraDry 30M system
    • 30 mm2 detector active area
    • 129 eV energy resolution at Mn k-alpha
    • Norvar window sensitive to Be
    • Up to 1M x-ray input CPS and 300K output CPS
    • Motorized slide for detector insertion and retraction
  • SEM Resolution Specifications
    • <0.6 nm 2-15 keV landing energy
    • <0.7 nm @ 1 keV with beam deceleration
    • <1.0 nm @ 500 eV with beam deceleration
    • <1.1 nm @ 250 eV with beam deceleration
  • Ion Resolution
    • <20 nm at 30 kV using preferred statistical method
    • <10 nm at 30 kV using selective edge method
  • Gas Injector
    • MultiChem Gas Delivery System
      • Allows up to 6 chemistries
      • Supports gaseous, liquid, and solid precursors
      • Flow control for each chemistry
      • Heating controls for up to 6 chemistries
      • Cooling available for 2 chemistries
      • Currently configured with Pt and C Deposition
  • Micromanipulator
    • ThermoFisher Easylift EX
      • Controls integrated into Microscope UI
      • Includes compucentric rotation capability
      • <50+/-30 nm smallest step size
      • <150 nm omni-directional repeatability
  • Included Software
    • Auto Slice & View 4 – FIB serial section tomography and EDS tomography
    • AutoScript 4 – Python based scripting for automated imaging and milling
  • Stages
    • 150 mm Stage
      • X,Y, and R axis use high precision piezo motors
      • X and Y travel ranges +/- 75 mm
      • Z travel range 10 mm
      • Rotation is +/- 360° either direction
      • Tilt range -38° to +60°

References

  1. Rate Limitations in Composite Solid-State Battery Electrodes: Revealing Heterogeneity with Operando Microscopy, A.L. Davis, V. Goel, D.W. Liao, M.N. Main, E. Kazyak, J. Lee, K. Thornton, N.P. Dasgupta, ACS Energy Letters, 6, 2993-3003, 2021
  2. Origins of Non-Random Particle Distributions and Implications to Abnormal Grain Growth in an Al-3.5 Wt Pct Cu Alloy, N. Lu, J. Kang, A.J. Shahani, Metallurgical and Materials Transactions A, 2021
  3. Hierarchical Microstructures and Deformation Behavior of Laser Direct-Metal-Deposited Cu-Fe Alloys, A. Chatterjee, E. Sprague, J. Mazumder, A. Misra, Materials Science and Engineering A, 802, 140659, 2021
  4. A High-Speed Metal-to-Polymer Direct Joining Technique and Underlying Bonding Mechanisms, F.C. Liu, P. Dong, X. Pei, Journal of Materials Processing Technology, 280, 116610, 2020

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